How to Design an HDI PCB for PCIe 5.0 & DDR5
Table of Contents You are designing a next-generation computing module, but your 112G SerDes and memory interfaces are failing signal...
How to Choose: HDI Any-Layer ELIC vs Sequential
For PCB designers pushing the limits of miniaturization, navigating the transition from conventional High-Density Interconnect (HDI) to Any-Layer ELIC (Every...
How to Transition Your SMT Layout to an Embedded Passive HDI Design
As devices shrink and high-speed signal integrity demands escalate, standard surface-mount technology (SMT) eventually hits a physical wall. When both...
IPC-2226 HDI Types: How to Choose Type I, II, or III
Table of Contents Choosing the correct routing classification dictates the line between a profitable production run and a budget-destroying fabrication...
How to Match HDI PCB Materials to Your Application's Signal Speed
Table of Contents 1. What Is HDI PCB Material Selection and Why Does It Matter for Signal Integrity? 2. How...
How to Pass HDI Microvia Thermal Cycling Qualifications
Table of Contents Up to 3% of complex interconnect boards pass standard electrical tests on the factory floor, only to...
How to Reduce Your HDI Sequential Lamination Cost by 30%
You design a dense high-speed board, optimize your routing, and submit it for quoting, only to suffer sticker shock when...
How to Calculate HDI Microvia Aspect Ratio for 99.5% Yield
You route a tight, high-density interconnect board, run your DRC checks, and send it to fabrication, only to face immediate...
HDI Stacked vs Staggered Microvia: Which Stops BGA Failure?
Table of Contents Every month, a hardware team comes to us after their prototype failed in the field, only to...
How to Choose Between Copper Fill vs Resin Fill for Via in Pad Design
Table of Contents Every week, a designer asks us why their high-density BGA board failed X-ray inspection. They thought specifying...
Ceramic PCB Thermal Cycling at 150 C: How to Pass
Design ceramic PCBs for -40 to 150 C cycling with better substrate choice, metallization and layout decisions for power and automotive reliability.
How to Prevent Ceramic PCB Warping After Eutectic Bonding
Prevent ceramic PCB warping after eutectic bonding by controlling copper symmetry, fixture limits, flatness, ramp rate and die-attach stress.