Materials
Choosing material and finish
Base material
Most 4-layer boards are built on FR-4. FR-4 is a family of laminates, so if your design depends on a property such as glass transition temperature (Tg) or dielectric constant at your operating frequency, name the grade or the values you need. High-Tg FR-4 and high-frequency Rogers and PTFE laminates are also available.
If you only know the operating conditions, describe them, for example the assembly reflow profile or the highest board temperature in use. We propose a material and you approve it before we build.
Surface finishes
- HASL
- A general-purpose finish that suits through-hole parts. The surface is not perfectly flat, so boards with fine-pitch or BGA parts usually go better with a flat finish.
- ENIG
- A flat nickel-and-gold finish for solder pads, including fine-pitch layouts. We measure nickel and gold thickness by XRF on every ENIG lot and can send the readings with the boards.
- ENEPIG
- Flat, with a palladium layer between nickel and gold. Used where the same board needs soldering and gold wire bonding.
- OSP
- An organic coating that protects exposed copper. Confirm storage conditions and the allowed reflow cycles for the selected process.
- Hard gold edge fingers
- For edge connectors that are plugged in repeatedly. Combined with another finish on the rest of the board; bevelling available.
Solder mask in green, black, blue, red or white, with a matte option. Carbon ink can be printed for keypad and switch contacts. Immersion silver and immersion tin are also available.