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EM-892K2: Halogen-Free M8 PCB Laminate for 112G Servers
EM-892K2 is EMC’s next-generation halogen-free M8-grade copper-clad laminate specifically engineered for 112 Gbps PAM4 AI servers, offering a dissipation factor (Df) of…
Megtron 8 PCB Guide: AI Server Specs & Manufacturing
Routing 112 Gbps PAM4 signals across backplanes pushes standard FR-4 materials past their physical breaking point, resulting in massive signal distortion and…
M9 CCL Guide: NVIDIA AI Server PCB Standards
Many hardware engineers struggle with severe signal degradation and thermal limits when routing 224G PAM4 transceivers on AI server backplanes. Standard laminates…
Tachyon 100G PCB Material Guide: Specs & 100Gbps Processing
Table of Contents You are laying out a 56 Gbps PAM4 switch backplane, and signal integrity simulations show your channel budget collapsing…
How to Design an HDI PCB for PCIe 5.0 & DDR5
Table of Contents You are designing a next-generation computing module, but your 112G SerDes and memory interfaces are failing signal integrity simulations….
How to Choose: HDI Any-Layer ELIC vs Sequential
For PCB designers pushing the limits of miniaturization, navigating the transition from conventional High-Density Interconnect (HDI) to Any-Layer ELIC (Every Layer Interconnect)…
How to Transition Your SMT Layout to an Embedded Passive HDI Design
As devices shrink and high-speed signal integrity demands escalate, standard surface-mount technology (SMT) eventually hits a physical wall. When both sides of…
IPC-2226 HDI Types: How to Choose Type I, II, or III
Table of Contents Choosing the correct routing classification dictates the line between a profitable production run and a budget-destroying fabrication nightmare. Engineering…
How to Match HDI PCB Materials to Your Application’s Signal Speed
Table of Contents 1. What Is HDI PCB Material Selection and Why Does It Matter for Signal Integrity? 2. How Do You…
How to Pass HDI Microvia Thermal Cycling Qualifications
Table of Contents Up to 3% of complex interconnect boards pass standard electrical tests on the factory floor, only to crack and…
How to Reduce Your HDI Sequential Lamination Cost by 30%
You design a dense high-speed board, optimize your routing, and submit it for quoting, only to suffer sticker shock when the price…
How to Calculate HDI Microvia Aspect Ratio for 99.5% Yield
You route a tight, high-density interconnect board, run your DRC checks, and send it to fabrication, only to face immediate DFM pushback….