S1000-2M is a high-Tg, lead-free-compatible FR-4 laminate from Shengyi Technology (with S1000-2MB prepreg), made for high-layer-count boards that go through repeated soldering. On Shengyi’s datasheet it has a Tg of 180°C (DSC) and 185°C (DMA), a Td of 355°C, a Z-axis expansion of only 2.4% from 50 to 260°C, and a Dk of 4.6 with a Df of 0.018 at 1 GHz. It is anti-CAF and listed to IPC-4101/126. Because it is a standard-loss epoxy, it is often used for power, ground and slower signal layers, while the fastest layers use a low-loss material. This page gathers the official values, shows Dk by construction, and explains where S1000-2M fits. For other laminates, see our PCB material selector.
1. What Is S1000-2M?
| Item | S1000-2M |
|---|---|
| Maker | Shengyi Technology |
| Laminate / prepreg | S1000-2M / S1000-2MB |
| Type | High-Tg FR-4, lead-free compatible, anti-CAF |
| IPC-4101 slash sheet | /126 (reference) |
| UL / ANSI grade | FR-4.0 |
| Applications listed by Shengyi | High-layer-count PCBs, computers, communications, automotive electronics |
| Laminate thickness range | 0.05–3.2 mm, copper 12–105 µm |
Source: Shengyi S1000-2M / S1000-2MB datasheet (CN-TDS-2308-04).
S1000-2M vs S1000-2: both are Shengyi high-Tg FR-4 grades on slash sheet /126; S1000-2M lists a lower Z-axis expansion (2.4% vs 2.8%) and longer T288 (30 vs 20 minutes) on Shengyi’s datasheets. Treat them as separate materials with their own datasheets.
2. What Does the Datasheet Say?
Typical values, 1.6 mm test laminate (7628 × 8):
| Property | S1000-2M | Method |
|---|---|---|
| Tg | 180°C (DSC), 185°C (DMA) | IPC-TM-650 2.4.25 / 2.4.24.4 |
| Td (5% weight loss) | 355°C | IPC-TM-650 2.4.24.6 |
| Time to delaminate | T260 > 60 min, T288 30 min, T300 15 min | IPC-TM-650 2.4.24.1 |
| Z-axis CTE below / above Tg | 41 / 208 ppm/°C | IPC-TM-650 2.4.24 |
| Z-axis expansion, 50–260°C | 2.4% | IPC-TM-650 2.4.24 |
| Dk / Df at 1 GHz | 4.6 / 0.018 | IPC-TM-650 2.5.5.9 |
| Water absorption | 0.08% | IPC-TM-650 2.6.2.1 |
| Peel strength, 1 oz (after 288°C float) | 1.3 N/mm | IPC-TM-650 2.4.8 |
| CTI | PLC 3 | IEC 60112 |
| Flammability | V-0 | UL 94 |
Values are typical, not guaranteed. Shengyi’s datasheet also lists storage: below 23°C and 50% RH for 3 months, or below 5°C for 6 months.
How do Dk and Df vary by construction?
Shengyi’s line-up gives values per core measured by split-post dielectric resonator. At 10 GHz:
| Core | Resin content | Thickness | Dk | Df |
|---|---|---|---|---|
| 2 × 106 | 77% | 0.127 mm | 3.66 | 0.025 |
| 1 × 1080 | 64% | 0.075 mm | 3.97 | 0.021 |
| 1 × 3313 | 57% | 0.100 mm | 4.14 | 0.021 |
| 1 × 7628 | 43% | 0.180 mm | 4.54 | 0.018 |
Dk ranges from about 3.7 to 4.5 depending on resin content, so calculate impedance from the cores in your stackup.
3. Why Does the Low Z-Axis Expansion Matter?
Because plated through-holes and vias are copper barrels that must stretch with the board as it heats. The less the laminate expands in thickness through reflow, the less strain on the plating. S1000-2M’s 2.4% compares with 4.3–4.5% for standard FR-4 grades such as Kingboard KB-6160 and Shengyi S1141, which is why it suits thick, high-layer-count boards and repeated lead-free soldering. See our FR-4 material guide for how Tg, Td and expansion relate.
4. Where Does S1000-2M Fit in a Stackup?
Its loss (Df about 0.018–0.025 depending on construction and frequency) is that of a standard epoxy, so it is not a high-speed material. It works well as:
- The whole board for multilayer designs without very fast signals.
- The power, ground and slower signal layers in a hybrid stackup, with a low-loss laminate on the fastest layers. Hybrid builds need materials the fabricator has qualified together for lamination and expansion; see our guide to FR408HR in hybrid stackups.
When the signals need lower loss, Shengyi’s own low-loss families, such as Synamic 6N and 8GN, or other makers’ materials such as Megtron 4, are the next step.
5. How Do You Specify S1000-2M?
| Item | What to write |
|---|---|
| Material | “Shengyi S1000-2M / S1000-2MB” |
| Specification | IPC-4101/126 |
| Substitution | “Equivalent per IPC-4101/126 with Z-axis expansion ≤ 2.5%” or “no substitution without approval” |
| Stackup | Core and prepreg build per layer, or “fabricator to propose” |
| Impedance | Targets; calculate with construction-specific Dk |
Adding the property that matters to you (here, Z-axis expansion) to the substitution rule stops an “equivalent” from being a weaker high-Tg grade.
How Can We Help?
Send your stackup with the material you specified and your Gerber files; we will confirm S1000-2M availability and constructions in the quote, which comes back within 2 hours for bare boards. We build multilayer PCBs up to 40 layers.
Conclusion
S1000-2M is Shengyi’s high-Tg, anti-CAF FR-4 for multilayer boards: Tg 180°C (DSC), Td 355°C, T288 30 minutes and only 2.4% Z-axis expansion, with standard-epoxy loss (Dk 4.6, Df 0.018 at 1 GHz). Use it for thick and high-layer-count boards that see repeated lead-free soldering, and for the non-critical layers of hybrid high-speed stackups. Contact us for a quote.
FAQ
What is S1000-2M? A high-Tg, lead-free-compatible, anti-CAF FR-4 laminate from Shengyi Technology, with S1000-2MB prepreg.
What is the Tg of S1000-2M? 180°C by DSC and 185°C by DMA.
What is the Dk of S1000-2M? 4.6 at 1 GHz on the main datasheet; about 3.7 to 4.5 at 10 GHz depending on the core construction.
Is S1000-2M a high-speed material? No. Its loss is that of standard epoxy FR-4; use a low-loss laminate for the fastest signals.
What is the difference between S1000-2 and S1000-2M? Both are high-Tg FR-4 on IPC-4101/126; S1000-2M lists lower Z-axis expansion and longer T288 on Shengyi’s datasheets.
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